Would you like to help build the next generation Wi-Fi chips that will enable a new generation of Internet of Things (IoT) devices? Then join Australia’s hottest semiconductor startup. You’ll work with the team that invented Wi-Fi 20 years ago, and help them shape the future of Wi-Fi for IoT.

You will be responsible for all aspects of product engineering and ATE test development at Morse Micro; from new production introduction to yield improvements and RMA support. Initially the role will be supported by external test program developers, so excellent project management skills will be essential.

As the first product engineer at Morse Micro this is an outstanding opportunity for an ambitious and driven engineer to get in early and play a key role in the growth of the company.  

Starting date for this position would be May - June.

Responsibilities include:

  • New product introduction

  • Test Program development (hardware and software)

  • Characterization

  • Collaboration with design team on DFT

  • Validation of new products on ATE

  • Manage and optimize production yield and quality

  • ATE cost optimization

  • Management of CM test

  • RMA support

  • Correlation of ATE with bench evaluation

  • Reliability Qualification; Burn In, ESD, Latch up etc

  • Management of outsourced test development, including platform and vendor choice

What we’re looking for:

  • Product/Test Development engineer with 7+ years relevant industry experience

  • Experience taking wireless chips to mass production

  • MSc or PhD in Electrical / Electronics / Communications Engineering

  • Experience ATE testing wireless SOC & circuits; radios, calibration circuits, processors, memories, switched and linear power management circuits

  • Experience programming ATE such as Teradyne UltraFLEX

  • Expert in design for test and all production test techniques; IDDQ, scan chain etc

  • Excellent project management skills with demonstrable experience of meeting project timelines

  • Experience working with IC design teams to improve testability

  • Knowledge of semiconductor fabrication process; mask making, assembly, QA

  • Familiarity with the IEEE 802.11 standard

  • Excellent verbal and written communication skills

  • Strong problem-solving skills and thorough methodical work style

  • The capacity to think for oneself

  • A good understanding of wireless systems (OFDM, LNAs, etc)

If you would like to apply, send your resume and cover letter to