MM6108-EKH01-03 Manufacturing Program (SDIO) 1.9.5
MM6108-EKH01-05-US Manufacturing Program (SDIO) 1.11.3
EKH03_v4
The EKH03 v4 Design Package provides the full reference files for Morse Micro’s MM6108-EKH03 access point platform. It includes schematics, PCB layout, BOM, and hardware assets built around the MTK7628 + MM6108 configuration.
MM6108-EKH01 Evaluation Kit User Guide 2.5
The MM6108 Evaluation Kit User Guide v2.5 provides comprehensive instructions for deploying and configuring Morse Micro’s Wi-Fi HaLow evaluation hardware under OpenWRT. It covers device setup, operating modes (AP, STA, mesh, virtual-wire), UI and CLI commands, performance testing, and troubleshooting—designed to help engineers evaluate and integrate the MM6108 chipset.
Target Wake Time (TWT) (App Note 03)
The “Target Wake Time (App Note 03)” explains how TWT (Target Wake Time) is implemented and managed in Wi-Fi HaLow systems to improve power efficiency. It covers negotiation, scheduling, and use cases for battery-powered devices.
MMECH06 Design Package
The MMECH06 Design Package provides the reference carrier board files for Morse Micro’s MM6108-EKH01 IoT development kit. It includes schematics, layout files, and BOM to support integrating the carrier with the MM6108 module.
MM6108-EKH01-05-US Manufacturing Program (SPI) 1.11.3
Morsectrl Guide (App Note 13)
The “MorseCtrl Guide (App Note 13)” is a reference for using the `morsectrl` command-line utility to manage Morse Micro Wi-Fi HaLow modules. It explains commands for configuration, monitoring, firmware upgrade, and diagnostics.
MM6108-MF08651-US (Bailey v13_2)
The MM6108-MF08651-US Design Package contains the reference files for Morse Micro’s MM6108 module, with schematics, layout, and module hardware details. This package supports development using the Wi-Fi HaLow MM6108-MF08651-US for IoT applications.
MM6108-MF08651-US Data Sheet
The MM6108-MF08651-US Data Sheet provides the specifications, electrical characteristics, and design guidelines for Morse Micro’s Wi-Fi HaLow sub-1 GHz module. It includes pinouts, RF performance, power requirements, and mechanical footprint details.
